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374724B60024G - 

Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm

374724B60024G - Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm

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Manufacturer Part No:
374724B60024G
Newark Part No.:
41R3499
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
15.3°C/W
:
18mm
:
35mm
:
35mm
:
-
:
Aluminium
:
0.7"
:
1.4"
:
1.4"
:
-
:
-
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Product Overview

The 374724B60024G is a silver solder-anchor Heat Sink for use with FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Solder anchors provide the most rugged mounting in the industry
  • Simple tool-free installation
  • Minimal PC board real estate is required for mounting
  • Lip design allows for easy removal in case of rework
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T766 chomerics phase change for all surfaces

Applications

HVAC, Thermal Management

Footnotes

Requires two anchors.

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