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AAVID THERMALLOY  374724B60024G  Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm

AAVID THERMALLOY 374724B60024G
Manufacturer Part No:
374724B60024G
Newark Part No.:
41R3499
Technical Datasheet:
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Product Overview

The 374724B60024G is a silver solder-anchor Heat Sink for use with FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Solder anchors provide the most rugged mounting in the industry
  • Simple tool-free installation
  • Minimal PC board real estate is required for mounting
  • Lip design allows for easy removal in case of rework
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T766 chomerics phase change for all surfaces
Requires two anchors.

Product Information

Packages Cooled:
BGA
Thermal Resistance:
15.3°C/W
External Height - Metric:
18mm
External Width - Metric:
35mm
External Length - Metric:
35mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.7"
External Width - Imperial:
1.4"
External Length - Imperial:
1.4"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
No SVHC (17-Dec-2015)

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Applications

  • HVAC
  • Thermal Management

Notes

Requires two anchors.

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Associated Products