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AAVID THERMALLOY  374424B00032G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 °C/W, 18 mm, 27 mm, 27 mm

AAVID THERMALLOY 374424B00032G
Technical Data Sheet (77.81KB) EN See all Technical Docs

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Product Overview

The 374424B00032G is a white pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Tape mounting saves board space by eliminating mounting holes
  • Convenient peel and stick assembly is quick and clean
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T405R Chomerics tape for metal surface
  • Acrylic adhesive

 

Product Information

Packages Cooled:
BGA
Thermal Resistance:
20.3°C/W
External Height - Metric:
18mm
External Width - Metric:
27mm
External Length - Metric:
27mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.709"
External Width - Imperial:
1.063"
External Length - Imperial:
1.063"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
To Be Advised

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Applications

  • HVAC;
  • Thermal Management

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Associated Products