Low

374424B00032G - 

Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 °C/W, 18 mm, 27 mm, 27 mm

374424B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 °C/W, 18 mm, 27 mm, 27 mm

The actual product may differ from image shown

Manufacturer Part No:
374424B00032G
Newark Part No.:
51R8103
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
20.3°C/W
:
18mm
:
27mm
:
27mm
:
-
:
Aluminium
:
0.709"
:
1.063"
:
1.063"
:
-
:
-
Find similar products Choose and modify the attributes above to find similar products.

Product Overview

The 374424B00032G is a white pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Tape mounting saves board space by eliminating mounting holes
  • Convenient peel and stick assembly is quick and clean
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T405R Chomerics tape for metal surface
  • Acrylic adhesive

Applications

HVAC, Thermal Management

Associated Products

Compare Selected

Related Searches

US continental orders over $49 and under 50 pounds may qualify for free ground shipping. Click the link for the full Terms and Conditions of the offer.

265 In stock

for same day shipping

see cut-off times
 
Check stock and lead times
More stock available week commencing 2/26/18
$1.83 $ 1.83
Price for:
Each
Multiple: 1 Minimum: 1
Quantity Price
1 + $1.83
10 + $1.80
25 + $1.69
50 + $1.63
100 + $1.59
250 + $1.45
500 + $1.28
1000 + $1.13
No longer stocked:: No Longer Manufactured::
Add to Cart
Total Price:
Total Price: ( )
Total Price: --

Customer Reviews

Customer Q&A Exchange

Community

Like to see information about this product from other customers?

 Read discussions, blogs, documents from our community members.

Filters:

Select document type(s) you want to see and click “Apply Filters” button
Post a question to one of our experts or start a discussion and get responses from supplier experts and fellow engineers in our community.