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AAVID THERMALLOY  374124B00035G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm

AAVID THERMALLOY 374124B00035G
Technical Data Sheet (16.94KB) EN See all Technical Docs

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Product Overview

The 374124B00035G is a clear/silver pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Tape mounting saves board space by eliminating mounting holes
  • Convenient peel and stick assembly is quick and clean
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T411 Chomerics tape for all surfaces
  • Silicone adhesive

 

Product Information

Packages Cooled:
BGA
Thermal Resistance:
23.4°C/W
External Height - Metric:
18mm
External Width - Metric:
23mm
External Length - Metric:
23mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.709"
External Width - Imperial:
0.906"
External Length - Imperial:
0.906"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
No SVHC (17-Dec-2015)

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Applications

  • HVAC;
  • Thermal Management

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Substitutes

HEATSINK, BGA

AAVID THERMALLOY

3,130:  in stock

Price for: Each

1+ $1.99 100+ $1.60 250+ $1.45 500+ $1.33 More pricing

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