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374124B00032G - 

Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm

374124B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm

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Manufacturer Part No:
374124B00032G
Newark Part No.:
53R2166
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
23.4°C/W
:
18mm
:
23mm
:
23mm
:
-
:
Aluminium
:
0.709"
:
0.906"
:
0.906"
:
-
:
-
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Product Overview

  • Tape mounting saves board space by eliminating mounting holes
  • Convenient peel and stick assembly is quick and clean
  • Pin-Fin array allows omni-directional airflow to maximize heat dissipation
  • Fin dimensions (LxW): 6x6mm

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